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Proceedings Papers

Comparison of IZOD Impact Energies and Ductile to Brittle Transition Behavior of 3D Printed vs. Sheet Extruded Polymers

Cameron Coates, Aaron Adams, Wayne Johnson, Ryan Foster, Christian Cook
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A024, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113095
https://doi.org/10.1115/IMECE2023-113095
View Paper titled, Comparison of IZOD Impact Energies and Ductile to Brittle Transition Behavior of 3D Printed vs. Sheet Extruded Polymers
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Topics: Additive manufacturing, Brittleness, Polymers, Impact strength, Temperature, Unsaturated polyesters
Proceedings Papers

Low Cost Pressure Gauges

Summer Dann-Johnson, Wayne Johnson, Mike Luckham, Kristen Marsh
Proc. ASME. IMECE96, Advances in Bioengineering, 61-62, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1114
https://doi.org/10.1115/IMECE1996-1114
View Paper titled, Low Cost Pressure Gauges
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Topics: Design, Engineering prototypes, Pressure measurement, Vacuum gages
Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
https://doi.org/10.1115/1.4034854
Published Online: October 20, 2016
View Article titled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling
Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
View Article titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Proceedings Papers

Convective Electronic Device Cooling Using Microencapsulated Phase Change Material Slurry in Planar Spiral Coil

Houman B. Rokni, Ehsan M. Languri, Wayne Johnson
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52748
https://doi.org/10.1115/IMECE2015-52748
View Paper titled, Convective Electronic Device Cooling Using Microencapsulated Phase Change Material Slurry in Planar Spiral Coil
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Topics: Cooling, Phase change materials, Slurries, Heat, Thermal management, Flow (Dynamics), Heat exchangers, Heat transfer, Temperature, Boundary-value problems
Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48771
https://doi.org/10.1115/IPACK2015-48771
View Paper titled, Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules
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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design
Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48083
https://doi.org/10.1115/IPACK2015-48083
View Paper titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms

Joshua Gess, Sushil H. Bhavnani, R. Wayne Johnson
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A084, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38866
https://doi.org/10.1115/IMECE2014-38866
View Paper titled, Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms
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Topics: Thermal resistance, Data centers, Flow (Dynamics), Fluid dynamics, Heat, Condensation, Design, Electronics, Energy consumption, Energy resources
Proceedings Papers

Effect of Flow Instabilities and Self-Sustained Oscillations on Labyrinth Seal Leakage Resistance

David L. Rhode, J. Wayne Johnson, Brian F. Allen
Proc. ASME. GT1997, Volume 3: Heat Transfer; Electric Power; Industrial and Cogeneration, V003T09A040, June 2–5, 1997
Publisher: American Society of Mechanical Engineers
Paper No: 97-GT-214
https://doi.org/10.1115/97-GT-214
View Paper titled, Effect of Flow Instabilities and Self-Sustained Oscillations on Labyrinth Seal Leakage Resistance
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Topics: Flow instability, Leakage, Oscillations, Flow (Dynamics), Bifurcation, Stability, Clearances (Engineering), Computers, Deflection, Trajectories (Physics)
Proceedings Papers

Cooling of High-Performance Server Modules Using Direct Immersion

Aravind Sridhar, Sarah Styslinger, Christopher Duron, Sushil H. Bhavnani, Roy W. Knight, Daniel Harris, R. Wayne Johnson
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 759-765, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58433
https://doi.org/10.1115/HT2012-58433
View Paper titled, Cooling of High-Performance Server Modules Using Direct Immersion
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Topics: Cooling, Heat, Boiling, Flat heat pipes, Heat flux, Temperature, Computer simulation, Copper, Dielectric liquids, Energy dissipation
Proceedings Papers

Navier-Stokes and Comprehensive Analysis Performance Predictions of the NREL Phase VI Experiment

Earl P. N. Duque, Michael D. Burklund, Wayne Johnson
Proc. ASME. WIND2003, ASME 2003 Wind Energy Symposium, 43-61, January 6–9, 2003
Publisher: American Society of Mechanical Engineers
Paper No: WIND2003-355
https://doi.org/10.1115/WIND2003-355
View Paper titled, Navier-Stokes and Comprehensive Analysis Performance Predictions of the NREL Phase VI Experiment
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Topics: Computation, Delays, Dynamics (Mechanics), Horizontal axis wind turbines, NASA, Rotors, Stress, Vortices, Wind tunnels, Wind turbines
Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35318
https://doi.org/10.1115/IPACK2003-35318
View Paper titled, Drop Reliability of Corner Bonded CSP in Portable Products
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills

Saiful Islam, Pradeep Lall, Jeffrey C. Suhling, R. Wayne Johnson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 27-40, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42083
https://doi.org/10.1115/IMECE2003-42083
View Paper titled, Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills
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Topics: Creep, Damage, Fatigue, Fatigue life, Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Machinery, Mechanical testing
Proceedings Papers

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Dhananjay Panchgade, Jeffrey Suhling, Larry Crane
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 135-143, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42075
https://doi.org/10.1115/IMECE2003-42075
View Paper titled, Drop-Impact Reliability of Chip-Scale Packages in Handheld Products
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Topics: Reliability, Corners (Structural elements), Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-433, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62317
https://doi.org/10.1115/IMECE2004-62317
View Paper titled, Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact
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Topics: Ball-Grid-Array packaging, Data acquisition systems, Deformation, Dynamics (Mechanics), Electronic products, Errors, Failure, Finite element model, Kinematics, Modeling
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling
Journal Articles

Navier-Stokes and Comprehensive Analysis Performance Predictions of the NREL Phase VI Experiment

Earl P. N. Duque, Michael D. Burklund, Wayne Johnson
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Technical Papers
J. Sol. Energy Eng. November 2003, 125(4): 457–467.
https://doi.org/10.1115/1.1624088
Published Online: November 26, 2003
View Article titled, Navier-Stokes and Comprehensive Analysis Performance Predictions of the NREL Phase VI Experiment
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Topics: Blades, Computation, Delays, Flow (Dynamics), Pressure, Rotors, Wind velocity, Yaw, Errors, Wind turbines