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Thomas W. Kenny
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Proceedings Papers

A Novel Dual-Axial AFM Cantilever With Independent Piezoresistive Sensors for Simultaneous Detection of Lateral and Vertical Forces

Benjamin W. Chui, Thomas W. Kenny, H. Jonathon Mamin, Bruce D. Terris, Daniel Rugar
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 55-59, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0939
https://doi.org/10.1115/IMECE1997-0939
View Paper titled, A Novel Dual-Axial AFM Cantilever With Independent Piezoresistive Sensors for Simultaneous Detection of Lateral and Vertical Forces
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Topics: Atomic force microscopy, Cantilevers, Sensors, Deflection, Probes, Signals, Piezoresistors
Proceedings Papers

Fracture and Sub-Critical Crack Growth Behavior of Micromachined Single Crystal Silicon Structures

Alissa M. Fitzgerald, R. Suryanarayanan Iyer, Reinhold H. Dauskardt, Thomas W. Kenny
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 395-399, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1275
https://doi.org/10.1115/IMECE1998-1275
View Paper titled, Fracture and Sub-Critical Crack Growth Behavior of Micromachined Single Crystal Silicon Structures
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Topics: Crystals, Fracture (Materials), Micromachining, Silicon, Stress, Electrical resistance, Geometry
Proceedings Papers

Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment

J. Kurth Reynolds, David C. Catling, Randy C. Blue, Nadim Maluf, Thomas W. Kenny
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 401-406, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1276
https://doi.org/10.1115/IMECE1998-1276
View Paper titled, Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment
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Topics: Instrumentation, Packaging, Pressure sensors, Sensors, Temperature, Atmospheric pressure, Calibration, Errors, Fluctuations (Physics), NASA
Proceedings Papers

Fluid Transport Mechanisms in Microfluidic Devices

Joshua I. Molho, Amy E. Herr, Thomas W. Kenny, M. Godfrey Mungal, Manish Deshpande, John R. Gilbert, Michael G. Garguilo, Phillip H. Paul, Pamela M. St. John, Timothy M. Woudenberg, Charles Connell
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 69-76, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1224
https://doi.org/10.1115/IMECE1998-1224
View Paper titled, Fluid Transport Mechanisms in Microfluidic Devices
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Topics: Fluids, Microfluidics, Flow (Dynamics), Pressure gradient, Electrokinetics, Imaging, Microfabrication, Pressure
Proceedings Papers

Design of Resonant Beam Transducers: An Axial Force Probe for Atomic Force Microscopy

Jonah A. Harley, Eugene M. Chow, Thomas W. Kenny
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 247-252, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1249
https://doi.org/10.1115/IMECE1998-1249
View Paper titled, Design of Resonant Beam Transducers: An Axial Force Probe for Atomic Force Microscopy
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Topics: Atomic force microscopy, Design, Probes, Resonance, Transducers, Oscillations, Resolution (Optics), Design engineering, Dimensions, Elastic constants
Proceedings Papers

Squeeze Film Damping Effects in a Micromachined Tunneling Accelerometer

Mark G. da Silva, Ken Greiner, Cheng-Hsien Liu, Thomas W. Kenny, John R. Gilbert
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 87-92, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0250
https://doi.org/10.1115/IMECE1999-0250
View Paper titled, Squeeze Film Damping Effects in a Micromachined Tunneling Accelerometer
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Topics: Accelerometers, Damping, Micromachining, Tunnel construction, Design, Knudsen number, Microelectromechanical systems, Mirrors, Modeling
Proceedings Papers

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0324
https://doi.org/10.1115/IMECE1999-0324
View Paper titled, Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage
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Topics: Data storage systems, Heat transfer, Modeling, Thermomechanics, Polymers, Cantilevers, Temperature, Atomic force microscopy, Heat, Phonons
Proceedings Papers

Performance Characterization of Micromachined Tunneling Infrared Detectors

Olaleye Ajakaiye, Choongsoo Shin, John Grade, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 35-40, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23805
https://doi.org/10.1115/IMECE2001/MEMS-23805
View Paper titled, Performance Characterization of Micromachined Tunneling Infrared Detectors
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Topics: Microelectromechanical systems, Micromachining, Performance characterization, Sensors, Tunnel construction, Noise (Sound), Manufacturing, Semiconductor wafers
Proceedings Papers

Through-Wafer Electrical Interconnects for MEMS Sensors

Venkataraman Chandrasekaran, Eugene M. Chow, Thomas W. Kenny, Toshikazu Nishida, Mark Sheplak
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 319-324, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23846
https://doi.org/10.1115/IMECE2001/MEMS-23846
View Paper titled, Through-Wafer Electrical Interconnects for MEMS Sensors
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Topics: Microelectromechanical systems, Semiconductor wafers, Sensors, Capacitance, Manufacturing, Noise (Sound), Polysilicon, Silicon, Boron, Heat conduction
Proceedings Papers

Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance

Daniel J. Laser, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 531-535, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23876
https://doi.org/10.1115/IMECE2001/MEMS-23876
View Paper titled, Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance
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Topics: Microelectromechanical systems, Micromachining, Pumps, Separation (Technology), Silicon, Micropumps, Design, Electrical measurement, Energy consumption, Engineering prototypes
Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23820
https://doi.org/10.1115/IMECE2001/MEMS-23820
View Paper titled, Microscale Liquid Impingement Cooling
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Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices
Proceedings Papers

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1082
https://doi.org/10.1115/IMECE2000-1082
View Paper titled, Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions
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Topics: Boundary-value problems, Heat flux, Microchannels, Modeling, Two-phase flow, Boiling, Dimensions, Flow (Dynamics), Silicon, Bubbles
Proceedings Papers

Electroosmotic Flow Suppression and Its Implications for a Miniaturized Full-Field Detection Approach to Capillary Isoelectric Focusing (cIEF)

Amy E. Herr, James C. Mikkelsen, Jr., Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 513-518, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1139
https://doi.org/10.1115/IMECE2000-1139
View Paper titled, Electroosmotic Flow Suppression and Its Implications for a Miniaturized Full-Field Detection Approach to Capillary Isoelectric Focusing (cIEF)
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Topics: Electroosmosis, Flow (Dynamics), Gages, Light-emitting diodes, Microscopes, Proteins, Separation (Technology), Transport processes
Proceedings Papers

A Three-Axis Piezoresistive Micromachined Force Sensor for Studying Cockroach Biomechanics

Michael S. Bartsch, Aaron Partridge, Beth L. Pruitt, Robert J. Full, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 443-448, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1129
https://doi.org/10.1115/IMECE2000-1129
View Paper titled, A Three-Axis Piezoresistive Micromachined Force Sensor for Studying Cockroach Biomechanics
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Topics: Biomechanics, Force sensors, Micromachining, Corners (Structural elements), Piezoresistors, Resolution (Optics), Sensors, Silicon, Strain gages
Proceedings Papers

Anharmonic Phonon Dispersion Relations, Group Velocities, and Branch-Dependent Specific Heat Capacities Measured Directly From Molecular Dynamics Simulations at Finite Temperatures

Timothy S. English, Thomas W. Kenny, Justin L. Smoyer, Christopher H. Baker, Nam Q. Le, John C. Duda, Pamela M. Norris, Patrick E. Hopkins
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 617-624, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58459
https://doi.org/10.1115/HT2012-58459
View Paper titled, Anharmonic Phonon Dispersion Relations, Group Velocities, and Branch-Dependent Specific Heat Capacities Measured Directly From Molecular Dynamics Simulations at Finite Temperatures
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Topics: Dispersion relations, Molecular dynamics simulation, Phonons, Specific heat, Temperature, Graphene, Pressure, Simulation, Thermal conductivity
Proceedings Papers

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Yoon Jin Won, Jae ho Lee, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 491-496, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89257
https://doi.org/10.1115/InterPACK2009-89257
View Paper titled, An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device
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Topics: Design, Impingement cooling, Microelectromechanical systems, Optimization, Cooling, Computer cooling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Pressure drop
Proceedings Papers

3-D Visualization of Flow in Microscale Jet Impingement System

Yoon Jin Won, Milnes David, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 759-764, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82092
https://doi.org/10.1115/ICNMM2009-82092
View Paper titled, 3-D Visualization of Flow in Microscale Jet Impingement System
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Topics: Flow (Dynamics), Microscale devices, Visualization, Impingement cooling, Design, Electronics, Heat transfer, Jets, Resolution (Optics)
Proceedings Papers

CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators

Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, Chandra M. Jha, Manu Agarwal, Saurabh A. Chandorkar, Thomas W. Kenny
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 499-504, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33234
https://doi.org/10.1115/IPACK2007-33234
View Paper titled, CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators
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Topics: Complementary metal oxide semiconductors, Microelectromechanical systems, Semiconductor wafers, Stability, Temperature, Composite materials, Packaging, Q-factor, Sealing (Process), Silicon
Proceedings Papers

An Improved Method of Thermal Resistance Measurement for Variable Thermal Resistors

Hyeun-Su Kim, Hyun Oh Song, Thomas W. Kenny
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 249-253, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33879
https://doi.org/10.1115/IPACK2007-33879
View Paper titled, An Improved Method of Thermal Resistance Measurement for Variable Thermal Resistors
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Topics: Resistors, Thermal resistance, Signals, Contact resistance, Steady state, Temperature, Transients (Dynamics)
Proceedings Papers

Wafer Scale Encapsulation of MEMS Devices

Woo-Tae Park, Rob N. Candler, Huimou J. Li, Junghwa Cho, Holden Li, Thomas W. Kenny, Aaron Partridge, Gary Yama, Markus Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 209-212, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35032
https://doi.org/10.1115/IPACK2003-35032
View Paper titled, Wafer Scale Encapsulation of MEMS Devices
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Topics: Microelectromechanical systems, Semiconductor wafers, Packaging, Silicon, Electronics, MEMS packaging, Sealing (Process), Wire bonding