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Satish C. Chaparala
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Proceedings Papers

Dynamic Analysis of Large Specialty Glass Panels Under Ball Drop Impact — Numerical Modeling and Measurements

Satish C. Chaparala, Praveen R. Samala, Joshua M. Jacobs, Jonathan D. Pesansky
Proc. ASME. IMECE2012, Volume 4: Dynamics, Control and Uncertainty, Parts A and B, 751-757, November 9–15, 2012
Paper No: IMECE2012-89458
DOI: https://doi.org/10.1115/IMECE2012-89458
View Paper titled, Dynamic Analysis of Large Specialty Glass Panels Under Ball Drop Impact — Numerical Modeling and Measurements
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Topics: Computer simulation, Dynamic analysis, Finite element analysis, Glass, Strain gages, Stress, Reliability, Brittleness, Electronics, Steel
Journal Articles

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011008.
DOI: https://doi.org/10.1115/1.4005910
Published Online: March 19, 2012
View Article titled, Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment
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Topics: Condensation, Lasers, Temperature, Cycles
Proceedings Papers

Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

Satish C. Chaparala, Lawrence C. Hughes, Jae Kwak, Seungbae Park
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 655-663, July 19–23, 2009
Paper No: InterPACK2009-89108
DOI: https://doi.org/10.1115/InterPACK2009-89108
View Paper titled, Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package
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Topics: Gallium arsenide, Lasers, Packaging, Thermomechanics
Proceedings Papers

Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 665-671, July 19–23, 2009
Paper No: InterPACK2009-89115
DOI: https://doi.org/10.1115/InterPACK2009-89115
View Paper titled, Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment
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Topics: Condensation, Gallium arsenide, Lasers
Proceedings Papers

Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS)

Sushma Madduri, William Infantolino, Bahgat G. Sammakia, Seungbae Park, Haojun Zhang, Satish C. Chaparala
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 279-285, November 13–19, 2009
Paper No: IMECE2009-12243
DOI: https://doi.org/10.1115/IMECE2009-12243
View Paper titled, Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS)
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Topics: Temperature effects, Epoxy adhesives, Epoxy resins, Temperature, Adhesives, Computation, Computational methods, Failure, Interferometry, Modeling
Proceedings Papers

Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)

Satish C. Chaparala, Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, Dipak Sengupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1397-1404, July 17–22, 2005
Paper No: IPACK2005-73085
DOI: https://doi.org/10.1115/IPACK2005-73085
View Paper titled, Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)
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Topics: Stress analysis (Engineering), Stress, Fracture (Materials), Packaging, Wire, Cracking (Materials), Density, Design, Engineers, Finite element methods
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Paper No: IPACK2005-73239
DOI: https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
Click here to open pdf in another window PDF for Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics