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Journal Articles

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011004.
Paper No: EP-19-1095
https://doi.org/10.1115/1.4047338
Published Online: June 4, 2020
View Article titled, Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging
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Topics: Adhesion, Copper, Flux (Metallurgy), Shear (Mechanics)
Journal Articles

By-Pass Air-Valve Control of an OWC Wave Power Plant

A. F. de O. Falca˜o, L. C. Vieira, P. A. P. Justino, J. M. C. S. Andre´
Journal: Journal of Offshore Mechanics and Arctic Engineering
Publisher: ASME
Article Type: Technical Papers
J. Offshore Mech. Arct. Eng. August 2003, 125(3): 205–210.
https://doi.org/10.1115/1.1576815
Published Online: July 11, 2003
View Article titled, By-Pass Air-Valve Control of an OWC Wave Power Plant
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Topics: Valves, Wave energy, Turbines, Pressure, Flow (Dynamics)
Journal Articles

A New Way of Solving Transient Radiative-Conductive Heat Transfer Problems

S. Andre, A. Degiovanni
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1998, 120(4): 943–955.
https://doi.org/10.1115/1.2825914
Published Online: November 1, 1998
View Article titled, A New Way of Solving Transient Radiative-Conductive Heat Transfer Problems
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Topics: Heat transfer, Radiation (Physics), Transients (Dynamics)