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Kenneth E. Goodson
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Proceedings Papers

Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures

Kaiying Jiang, Daeyoung Kong, Sreekant Narumanchi, James Palko, Ercan M. Dede, Chulmin Ahn, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141329
https://doi.org/10.1115/IPACK2024-141329
View Paper titled, Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures
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Topics: Boiling, Copper, Corrosion, Erosion, Nickel
Proceedings Papers

Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers

Daeyoung Kong, Heungdong Kwon, Haeun Lee, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141064
https://doi.org/10.1115/IPACK2024-141064
View Paper titled, Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers
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Topics: Computational fluid dynamics, Manifolds, Microchannels, Microcoolers, Modeling, Optimization, Silicon
Proceedings Papers

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
https://doi.org/10.1115/IPACK2024-140287
View Paper titled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
Open the PDF for High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape in another window
Topics: Composite materials, Copper, Gallium, Liquid metals, Nanowires, Polydimethylsiloxane, Thermal characterization, Thermal resistance, ASTM International, Contact resistance
Proceedings Papers

Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

Yujui Lin, Heungdong Kwon, Yini He, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140766
https://doi.org/10.1115/IPACK2024-140766
View Paper titled, Capillary-Based Two-Phase Cooling for High Power Density Power Electronics
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Topics: Cooling, Electronics, Power density, Thermal management
Proceedings Papers

Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application

Heungdong Kwon, Daeyoung Kong, Hyoungsoon Lee, James Palko, Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140613
https://doi.org/10.1115/IPACK2024-140613
View Paper titled, Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application
Open the PDF for Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application in another window
Topics: Boiling, Computer cooling, Flow (Dynamics), Heat, Manifolds, Microchannels, Microcoolers, Silicon
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Article titled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
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Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Article titled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
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Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0956
https://doi.org/10.1115/IMECE1997-0956
View Paper titled, Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films
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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)
Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1061
https://doi.org/10.1115/IMECE1999-1061
View Paper titled, Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path
Proceedings Papers

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0324
https://doi.org/10.1115/IMECE1999-0324
View Paper titled, Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage
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Topics: Data storage systems, Heat transfer, Modeling, Thermomechanics, Polymers, Cantilevers, Temperature, Atomic force microscopy, Heat, Phonons
Proceedings Papers

Thermal Conductivity of Porous Silicon Layers for MEMS

Uma Srinivasan, Peter Breh, Mehdi Asheghi, Maxat Touzelbaev, Kenneth E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 575-582, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0323
https://doi.org/10.1115/IMECE1999-0323
View Paper titled, Thermal Conductivity of Porous Silicon Layers for MEMS
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Topics: Microelectromechanical systems, Silicon, Thermal conductivity, Porosity, Temperature, Crystals, Electrical resistance, Electromagnetic scattering, Electron microscopy, Heating
Proceedings Papers

Contact Angle Tuning of Copper Microporous Structures

Farid Soroush, Tanya Liu, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73334
https://doi.org/10.1115/IPACK2021-73334
View Paper titled, Contact Angle Tuning of Copper Microporous Structures
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Topics: Copper
Proceedings Papers

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Farid Soroush, Tanya Liu, Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73309
https://doi.org/10.1115/IPACK2021-73309
View Paper titled, A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling
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Topics: Boiling, Copper, Liquid films
Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24377
https://doi.org/10.1115/IMECE2001/HTD-24377
View Paper titled, Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits
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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)
Proceedings Papers

Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance

Daniel J. Laser, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 531-535, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23876
https://doi.org/10.1115/IMECE2001/MEMS-23876
View Paper titled, Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance
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Topics: Microelectromechanical systems, Micromachining, Pumps, Separation (Technology), Silicon, Micropumps, Design, Electrical measurement, Energy consumption, Engineering prototypes
Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23820
https://doi.org/10.1115/IMECE2001/MEMS-23820
View Paper titled, Microscale Liquid Impingement Cooling
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Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices
Proceedings Papers

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1082
https://doi.org/10.1115/IMECE2000-1082
View Paper titled, Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions
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Topics: Boundary-value problems, Heat flux, Microchannels, Modeling, Two-phase flow, Boiling, Dimensions, Flow (Dynamics), Silicon, Bubbles
Journal Articles

Performance and Manufacturing of Silicon-Based Vapor Chambers

Tanya Liu, Mehdi Asheghi, Kenneth E. Goodson
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. January 2021, 73(1): 010802.
Paper No: AMR-20-1085
https://doi.org/10.1115/1.4049801
Published Online: February 18, 2021
View Article titled, Performance and Manufacturing of Silicon-Based Vapor Chambers
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Topics: Manufacturing, Silicon, Vapors, Heat
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling