1-3 of 3
H.-Y. Yeh
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
https://doi.org/10.1115/1.1478060
Published Online: July 26, 2002
View Article titled, Validation of Electronic Package Reliability Using Speckle Interferometry
Open the PDF for Validation of Electronic Package Reliability Using Speckle Interferometry in another window
Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles
Journal Articles

Effect of Transverse Moduli on Through-Thickness Hygrothermal Expansion Coefficients of Composite Laminates

H.-L. Yeh, H.-Y. Yeh
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. November 2001, 68(6): 878–879.
https://doi.org/10.1115/1.1410937
Published Online: June 23, 2001
View Article titled, Effect of Transverse Moduli on Through-Thickness Hygrothermal Expansion Coefficients of Composite Laminates
Open the PDF for Effect of Transverse Moduli on Through-Thickness Hygrothermal Expansion Coefficients of Composite Laminates in another window
Topics: Composite materials, Laminates, Thermal expansion
Journal Articles

Stress Analysis Applications to Service Failures of Traveling-Wave Tubes

H.-Y. Yeh
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 1984, 106(4): 533–537.
https://doi.org/10.1115/1.3269232
Published Online: October 1, 1984
View Article titled, Stress Analysis Applications to Service Failures of Traveling-Wave Tubes
Open the PDF for Stress Analysis Applications to Service Failures of Traveling-Wave Tubes in another window
Topics: Failure, Stress analysis (Engineering), Traveling waves, Stress, Stress concentration, Breakdown (Electricity), Design, Electric fields, Finite element analysis, Vacuum