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Allan D. Kraus
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Proceedings Papers

Heat Transfer Characteristics for a Single Fin in a Boiling Liquid

Yingzong Bu, Allan D. Kraus, Benjamin T. F. Chung
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 161-168, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1517
https://doi.org/10.1115/IMECE2000-1517
View Paper titled, Heat Transfer Characteristics for a Single Fin in a Boiling Liquid
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Topics: Boiling, Heat transfer, Temperature, Heat transfer coefficients, Algorithms, Cascades (Fluid dynamics), Electrical conductivity, Geometry, Heat flux, Temperature profiles
Journal Articles

Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate

Allan D. Kraus
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2012, 134(3): 031024.
https://doi.org/10.1115/1.4005161
Published Online: January 20, 2012
View Article titled, Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate
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Topics: Fins, Flow (Dynamics), Heat, Plates (structures), Algorithms, Cascades (Fluid dynamics)
Journal Articles

Discussion

Allan D. Kraus
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Discussion and Closure
J. Heat Mass Transfer. August 2004, 126(4): 660.
https://doi.org/10.1115/1.1755247
Published Online: August 1, 2004
View Article titled, Discussion
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Topics: Boiling, Fractals, Heat transfer
Journal Articles

Design of Optimum Plate-Fin Natural Convective Heat Sinks

Avram Bar-Cohen, Madhusudan Iyengar, Allan D. Kraus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
https://doi.org/10.1115/1.1568361
Published Online: June 10, 2003
View Article titled, Design of Optimum Plate-Fin Natural Convective Heat Sinks
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Topics: Design, Heat sinks, Heat transfer coefficients, Optimization, Heat transfer, Heat, Energy dissipation, Specific heat, Natural convection
Journal Articles

The Case for the Elliptical Spine

Gerald L. McIntyre, Allan D. Kraus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 217–220.
https://doi.org/10.1115/1.1569261
Published Online: June 10, 2003
View Article titled, The Case for the Elliptical Spine
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Topics: Mechanical admittance, Heat, Temperature
Journal Articles

Transient Heat Transfer in Extended Surfaces

A. Aziz, Allan D. Kraus
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. July 1995, 48(7): 317–350.
https://doi.org/10.1115/1.3005105
Published Online: July 1, 1995
View Article titled, Transient Heat Transfer in Extended Surfaces
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Topics: Analytical methods, Boundary-value problems, Composite materials, Computation, Fins, Flow (Dynamics), Fluids, Heat, Heat conduction, Natural convection
Journal Articles

Advances in Thermal Modeling of Electronic Components and Systems , Vol. 1

Avram Bar-Cohen, editor, Allan D. Kraus, editor, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1989, 111(2): 162.
https://doi.org/10.1115/1.3226523
Published Online: June 1, 1989
View Article titled, Advances in Thermal Modeling of Electronic Components and Systems , Vol. 1
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Topics: Electronic components, Modeling
Journal Articles

Sixty-Five Years of Extended Surface Technology (1922–1987)

Allan D. Kraus
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. September 1988, 41(9): 321–364.
https://doi.org/10.1115/1.3151910
Published Online: September 1, 1988
View Article titled, Sixty-Five Years of Extended Surface Technology (1922–1987)
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Topics: Boiling, Condensation, Electronic equipment, Heat, Heat exchangers, Heat transfer, Mass transfer, Numerical analysis