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Keywords: integrated circuit packaging
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Pressure Vessel Technol. November 2001, 123(4): 501–509.
Published Online: June 19, 2001
... by the PVP Division, October 31, 2000, revised manuscript received June 19, 2001. Associate Editor: Y. W. Kwon. 31 October 2000 19 June 2001 integrated circuit packaging encapsulation plastics Plastic encapsulation by transfer molding has now become by far the most common...
