A fivefold increase in adhesion energy is observed for poly(acrylic acid) (PAA) modified Cu/TaN interfaces in which the thin copper films are deposited by the hydrogen assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato) copper in supercritical carbon dioxide. The PAA adhesion layer is sacrificial at the reaction conditions used, and X-ray photoelectron spectroscopy has shown that the Cu/TaN interface is free of contamination following deposition. The resulting average interfacial adhesion energy is just above , which meets adhesion requirements for integration in Cu interconnects. The adhesion measurements are performed with a custom built four-point bend fracture mechanics testing system. Comparison of the copper film thickness to the measured adhesion energy indicated that there is no effect on the adhesion energy as the film thickness changes.
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April 2010
Research Papers
Quantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers
Christos F. Karanikas,
Christos F. Karanikas
Department of Chemical Engineering,
University of Massachusetts Amherst
, Amherst, MA 01003
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Han Li,
Han Li
School of Engineering and Applied Science,
Harvard University
, Cambridge, MA 02138
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Joost J. Vlassak,
Joost J. Vlassak
School of Engineering and Applied Science,
Harvard University
, Cambridge, MA 02138
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James J. Watkins
James J. Watkins
Department of Polymer Science and Engineering,
University of Massachusetts Amherst
, Amherst, MA 01003
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Christos F. Karanikas
Department of Chemical Engineering,
University of Massachusetts Amherst
, Amherst, MA 01003
Han Li
School of Engineering and Applied Science,
Harvard University
, Cambridge, MA 02138
Joost J. Vlassak
School of Engineering and Applied Science,
Harvard University
, Cambridge, MA 02138
James J. Watkins
Department of Polymer Science and Engineering,
University of Massachusetts Amherst
, Amherst, MA 01003J. Eng. Mater. Technol. Apr 2010, 132(2): 021014 (7 pages)
Published Online: February 22, 2010
Article history
Received:
November 20, 2008
Revised:
July 19, 2009
Online:
February 22, 2010
Published:
February 22, 2010
Citation
Karanikas, C. F., Li, H., Vlassak, J. J., and Watkins, J. J. (February 22, 2010). "Quantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers." ASME. J. Eng. Mater. Technol. April 2010; 132(2): 021014. https://doi.org/10.1115/1.4000283
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