... tetrahedron and thus not “bridge” two silicon atoms. Reichman et al. ( 28 ) reported that fluorescence increases from the periphery of the irradiated region toward its center, indicating an increase in the concentration of the defects. A similar trend is observed in this study when a 0.04 mm/s feed rate...

... for different applications. Control over the transformation temperatures as well as mechanical and shape memory properties is required to enable their widespread use. This study examines the effects of heat treatment time and temperature on the properties of amorphous, Ti-rich NiTi thin films on silicon...

... report the design and implementation of this new system. Experimental results demonstrate the effectiveness of the system and show that the microplasma can be used in various applications including localized etching of silicon and diamond and localized patterning of photoresist. 16 06 2009 04...

... by a heat-assisted laser shock peening process, using silicon crystal as a sample material. Strong dislocation activity and large compressive residual stress are induced by this process. The dislocation structure is characterized with transmission electron microscopy and electron backscattered diffraction...

...Youneng Wang; Hongqiang Chen; Jeffrey W. Kysar; Y. Lawrence Yao Micro-scale laser shock peening ( μ LSP ) can potentially be applied to metallic structures in microdevices to improve fatigue and reliability performance. Copper thin films on a single-crystal silicon substrate are treated by using μ...

...M. B. Cai; X. P. Li; M. Rahman In nanoscale ductile mode cutting of the monocrystalline silicon wafer, micro-, or nanogrooves on the diamond cutting tool flank face are often observed, which is beyond the understanding based on conventional cutting processes because the silicon workpiece material...

...-extrusion. Three different extrusion dies coated with diamondlike carbon with silicon (DLC-Si), chromium nitride (CrN), and titanium nitride (TiN) were used in the microextrusion experiments. All the coatings worked satisfactorily in reducing the friction and, correspondingly, the extrusion force...

...Yue Jiao; Z. J. Pei; Shuting Lei; E. Stanley Lee; Graham R. Fisher Silicon is the primary semiconductor material used to fabricate microchips, and the quality of microchips depends directly upon the quality of the starting silicon wafers. One of the manufacturing problems in silicon wafer...

... investigated, and the surface topographies before and after finishing were compared. When a microchannel was finished by proposed method, the roughness of bottom and side surfaces of the silicon channel was reduced by a factor of 5–10, and the pressure drop of a gas flow through the single microchannel...

...Jeong Woo Park; Noritaka Kawasegi; Noboru Morita; Deug Woo Lee The TNL (Tribo Nanolithography) method in aqueous solution uses the atomic force microscopy as a machining tool for the nanoscale fabrication of silicon. A specially designed cantilever with a diamond tip allows the formation of oxide...

...Masahiko Yoshino; Sivanandam Aravindan This paper reports on nanosurface fabrication of hard brittle materials by structured diamond tool imprinting. Ultrafine structured surfaces were fabricated on soda glass, firelite glass, quartz glass, quartz wafer, and silicon. A specially designed...

... scratching test device, and the pin-on-disc scratching tests were conducted with three (3) hard-brittle materials (i.e., silicon, glass, and quartz) under pressure of 400 MPa and zero MPa. Traces of scratches on these specimens were examined with microscopes to evaluate the effects of hydrostatic pressure...