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Journal Articles

Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening

Youneng Wang, Hongqiang Chen, Jeffrey W. Kysar, Y. Lawrence Yao

Publisher: ASME

J. Manuf. Sci. Eng. June 2007, 129(3): 485–496.

https://doi.org/10.1115/1.2714568

Published Online: November 10, 2006

... element analysis plasticity thin films silicon elemental semiconductors The reliability and failure of micro-electromechanical system (MEMS) are of concern for long-term applications and efforts have made on these aspects over the last few years ( 1 2 ). MEMS devices like switches and gears...

View Article titled, Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening

Topics: Grain size, Laser hardening, Shock (Mechanics), Silicon, Simulation, Thin films, X-ray diffraction, X-rays, Electron backscatter diffraction, Crystals

Journal Articles

Study of the Mechanism of Groove Wear of the Diamond Tool in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon

M. B. Cai, X. P. Li, M. Rahman

Publisher: ASME

J. Manuf. Sci. Eng. April 2007, 129(2): 281–286.

https://doi.org/10.1115/1.2673567

Published Online: September 18, 2006

.... 0021-8979 10.1063/1.321567 , 46 ( 12 ), pp. 5110 – 5113 . 10 03 2006 18 09 2006 wear diamond silicon elemental semiconductors ductility cutting tools integrated circuit manufacture molecular dynamics method cutting microgroove wear nanogroove wear nanoscale...

View Article titled, Study of the Mechanism of Groove Wear of the Diamond Tool in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon

Topics: Atoms, Cutting, Diamond tools, Diamonds, Nanoscale phenomena, Silicon, Wear, Temperature, Cutting tools, Phase transitions

Journal Articles

A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

Yue Jiao, Z. J. Pei, Shuting Lei, E. Stanley Lee, Graham R. Fisher

Publisher: ASME

J. Manuf. Sci. Eng. November 2006, 128(4): 938–943.

https://doi.org/10.1115/1.2335860

Published Online: April 28, 2006

... production engineering computing silicon elemental semiconductors 07 12 2005 28 04 2006 2006 American Society of Mechanical Engineers ...

View Article titled, A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

Topics: Grinding, Semiconductor wafers, Wire

Journal Articles

Surface Finishing and Evaluation of Three-Dimensional Silicon Microchannel Using Magnetorheological Fluid

Wook-Bae Kim, Seung-Hwan Lee, Byung-Kwon Min

Publisher: ASME

J. Manuf. Sci. Eng. November 2004, 126(4): 772–778.

https://doi.org/10.1115/1.1811113

Published Online: February 4, 2005

... Magnetorheological Fluid Microchannel surface finishing polishing abrasion channel flow magnetic fluids abrasives surface roughness magnetorheology micromechanical devices silicon elemental semiconductors microfluidics micromachining 01 February 2004 28 June 2004 04 02 2005...

View Article titled, Surface Finishing and Evaluation of Three-Dimensional Silicon Microchannel Using Magnetorheological Fluid

Topics: Finishing, Fluids, Microchannels, Silicon, Surface finishing, Surface roughness

Journal Articles

Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution

Jeong Woo Park, Noritaka Kawasegi, Noboru Morita, Deug Woo Lee

Publisher: ASME

J. Manuf. Sci. Eng. November 2004, 126(4): 801–806.

https://doi.org/10.1115/1.1811114

Published Online: February 4, 2005

... oxidation corrosion resistance pattern formation elemental semiconductors 01 February 2004 01 August 2004 04 02 2005 Contributed by Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING . Manuscript received February 2004...

View Article titled, Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution

Topics: Atomic force microscopy, Diamonds, Etching, Nanolithography, Silicon, Cantilevers, Corrosion resistance

Journal citation

NARROW

Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening

Study of the Mechanism of Groove Wear of the Diamond Tool in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon

A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

Surface Finishing and Evaluation of Three-Dimensional Silicon Microchannel Using Magnetorheological Fluid

Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening

Study of the Mechanism of Groove Wear of the Diamond Tool in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon

A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

Surface Finishing and Evaluation of Three-Dimensional Silicon Microchannel Using Magnetorheological Fluid

Mechanical Approach to Nanomachining of Silicon Using Oxide Characteristics Based on Tribo Nanolithography (TNL) in KOH Solution

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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