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Journal Articles

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Song Yuan, Xiaoguang Guo, Hao Wang, Shang Gao

J. Manuf. Sci. Eng. July 2023, 145(7): 071006.

Paper No: MANU-22-1408

DOI: https://doi.org/10.1115/1.4057008

Published Online: March 21, 2023

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Topics: Damage, Diamonds, Machining, Polishing, Simulation, Ultraviolet radiation

Journal Articles

Multi-resolution Quality Inspection of Layerwise Builds for Metal 3D Printer-and-Scanner

Hui Yang, Joni Reijonen, Alejandro Revuelta

J. Manuf. Sci. Eng.

Paper No: MANU-22-1587

DOI: https://doi.org/10.1115/1.4057013

Published Online: February 27, 2023

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Topics: Additive manufacturing, Inspection, Metals, Resolution (Optics), Imaging, Design, Laser fusion, Sensors, Damage, Finishes

Journal Articles

Frictional Damage Mechanism for Matrix Failure in Cutting Unidirectional CFRP

Chunlei Song, Xiaoliang Jin

J. Manuf. Sci. Eng. June 2023, 145(6): 061005.

Paper No: MANU-22-1590

DOI: https://doi.org/10.1115/1.4056751

Published Online: February 13, 2023

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Topics: Carbon reinforced plastics, Cutting, Damage, Failure, Fibers, Friction, Compression, Stress, Fracture (Materials)

Journal Articles

Controlling Damage Evolution in Geometrically Identical Cold Forged Parts by Counterpressure

Robin Gitschel, Oliver Hering, André Schulze, A. Erman Tekkaya

J. Manuf. Sci. Eng. January 2023, 145(1): 011011.

Paper No: MANU-22-1327

DOI: https://doi.org/10.1115/1.4056266

Published Online: December 1, 2022

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Topics: Damage, Extruding, Stress, Forging

Journal Articles

Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Hao Wang, Xiaoguang Guo, Zhigang Dong, Song Yuan, Yan Bao, Renke Kang

J. Manuf. Sci. Eng. November 2022, 144(11): 111008.

Paper No: MANU-21-1519

DOI: https://doi.org/10.1115/1.4054839

Published Online: July 26, 2022

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Topics: Cutting, Damage, Dislocations, Tungsten, Crystals

Journal Articles

Effect of Anisotropy on the Quality of Laser Cutting Corner of CFRP Plate

Wenyuan Li, Yu Huang, Long Chen, Xinghua Chen, Guojun Zhang, Youmin Rong

J. Manuf. Sci. Eng. November 2022, 144(11): 111003.

Paper No: MANU-21-1384

DOI: https://doi.org/10.1115/1.4054719

Published Online: June 22, 2022

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Topics: Carbon reinforced plastics, Corners (Structural elements), Cutting, Errors, Lasers, Damage, Laser cutting, Anisotropy

Journal Articles

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Jiqiang Wang, Yanquan Geng, Zihan Li, Yongda Yan, Xichun Luo, Pengfei Fan

J. Manuf. Sci. Eng. April 2022, 144(4): 041013.

Paper No: MANU-21-1127

DOI: https://doi.org/10.1115/1.4052356

Published Online: October 19, 2021

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Topics: Crystals, Damage, Machining, Nanochannels, Silicon, Vibration, Stress

Journal Articles

Damage Mechanisms of Material in Single-Cone Scratching

Linfa Peng, Zhutian Xu, Mengyun Mao, Xinmin Lai, Ming Wang Fu

J. Manuf. Sci. Eng. June 2021, 143(6): 061013.

Paper No: MANU-20-1102

DOI: https://doi.org/10.1115/1.4049478

Published Online: February 2, 2021

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Topics: Damage, Deformation, Fracture (Materials), Fracture (Process), Flow (Dynamics), Stress, Displacement, Friction, Ductile fracture

Journal Articles

Stress State Control by a Novel Bending Process and its Effect on Damage and Product Performance

Rickmer Meya, Christian Löbbe, A. Erman Tekkaya

J. Manuf. Sci. Eng. October 2019, 141(10): 101013.

Paper No: MANU-18-1727

DOI: https://doi.org/10.1115/1.4044394

Published Online: September 5, 2019

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Topics: Damage, Stress

Journal Articles

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

Jingfei Yin, Qian Bai, Bi Zhang

J. Manuf. Sci. Eng. October 2019, 141(10): 101012.

Paper No: MANU-18-1639

DOI: https://doi.org/10.1115/1.4044417

Published Online: September 4, 2019

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Topics: Damage, Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics), Semiconductor wafers, Stress, Grinding

Journal Articles

A Two-Step Model for Multiple Picosecond and Femtosecond Pulses Ablation of Fused Silica

Han Wang, Hong Shen, Zhenqiang Yao

J. Manuf. Sci. Eng. June 2019, 141(6): 061004.

Paper No: MANU-18-1048

DOI: https://doi.org/10.1115/1.4043308

Published Online: April 12, 2019

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Topics: Ablation (Vaporization technology), Electrons, Lasers, Temperature, Damage, Density, Ionization

Journal Articles

Effective Damage Indicator for Aluminum Alloy (AA6082Zr) Processed by ECAE

M.A. Agwa, M.N. Ali

J. Manuf. Sci. Eng. December 2018, 140(12): 121014.

Paper No: MANU-18-1205

DOI: https://doi.org/10.1115/1.4041479

Published Online: October 8, 2018

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Topics: Damage, Friction, Corners (Structural elements), Fracture (Materials), Ductile fracture, Finite element analysis, Extruding

Journal Articles

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Kamlesh Joshi, Upendra Bhandarkar, Indradev Samajdar, Suhas S. Joshi

J. Manuf. Sci. Eng. September 2018, 140(9): 091001.

Paper No: MANU-17-1751

DOI: https://doi.org/10.1115/1.4039647

Published Online: June 4, 2018

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Topics: Damage, Semiconductor wafers, Wire, Electrical discharge machining

Journal Articles

Grinding Characteristics, Material Removal, and Damage Formation Mechanisms of Zirconia Ceramics in Hybrid Laser/Grinding

Sheng Xu, Zhenqiang Yao, Jiawei He, Jian Xu

J. Manuf. Sci. Eng. July 2018, 140(7): 071010.

Paper No: MANU-17-1199

DOI: https://doi.org/10.1115/1.4039645

Published Online: May 11, 2018

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Topics: Ceramics, Damage, Grinding, Irradiation (Radiation exposure), Lasers, Fracture (Materials)

Journal Articles

An Eulerian Orthogonal Cutting Model for Unidirectional Fiber-Reinforced Polymers

Shengqi Zhang, John S. Strenkowski

J. Manuf. Sci. Eng. February 2018, 140(2): 021017.

Paper No: MANU-17-1175

DOI: https://doi.org/10.1115/1.4038612

Published Online: January 8, 2018

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Topics: Cutting, Damage, Fibers, Polymers

Journal Articles

Formability Prediction for Tube Hydroforming of Stainless Steel 304 Using Damage Mechanics Model

J. Yuenyong, M. Suthon, S. Kingklang, P. Thanakijkasem, S. Mahabunphachai, V. Uthaisangsuk

J. Manuf. Sci. Eng. January 2018, 140(1): 011006.

Paper No: MANU-17-1392

DOI: https://doi.org/10.1115/1.4038208

Published Online: November 14, 2017

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Topics: Damage, Failure, Forming limit diagrams, Simulation, Steel, Stainless steel, Fracture (Materials), Steel sheet, Nucleation (Physics), Pressure

Journal Articles

Adaptive Grinding Process—Prevention of Thermal Damage Using OPC-UA Technique and In Situ Metrology

Matthias Steffan, Franz Haas, Alexander Pierer, Gentzen Jens

J. Manuf. Sci. Eng. December 2017, 139(12): 121008.

Paper No: MANU-17-1189

DOI: https://doi.org/10.1115/1.4038123

Published Online: November 2, 2017

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Topics: Damage, Grinding, Control equipment

Journal Articles

Predicting Sheet Forming Limit of Aluminum Alloys for Cold and Warm Forming by Developing a Ductile Failure Criterion

Z. Q. Sheng, P. K. Mallick

J. Manuf. Sci. Eng. November 2017, 139(11): 111018.

Paper No: MANU-17-1455

DOI: https://doi.org/10.1115/1.4037609

Published Online: September 18, 2017

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Topics: Failure, Forming limit diagrams, Sheet materials, Temperature, Aluminum alloys, Tension, Damage

Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo

J. Manuf. Sci. Eng. August 2017, 139(8): 081012.

Paper No: MANU-16-1608

DOI: https://doi.org/10.1115/1.4036125

Published Online: May 10, 2017

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Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon

Journal Articles

Analysis on the Effects of Grinding Wheel Speed on Removal Behavior of Brittle Optical Materials

Ping Li, Tan Jin, Zongfu Guo, Jun Yi, Meina Qu

J. Manuf. Sci. Eng. March 2017, 139(3): 031014.

Paper No: MANU-16-1442

DOI: https://doi.org/10.1115/1.4034665

Published Online: October 6, 2016

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Topics: Brittleness, Damage, Grinding, Wheels, Surface roughness, Optical materials, Finishing

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Manuscript

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Multi-resolution Quality Inspection of Layerwise Builds for Metal 3D Printer-and-Scanner

Frictional Damage Mechanism for Matrix Failure in Cutting Unidirectional CFRP

Controlling Damage Evolution in Geometrically Identical Cold Forged Parts by Counterpressure

Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Effect of Anisotropy on the Quality of Laser Cutting Corner of CFRP Plate

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Damage Mechanisms of Material in Single-Cone Scratching

Stress State Control by a Novel Bending Process and its Effect on Damage and Product Performance

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

A Two-Step Model for Multiple Picosecond and Femtosecond Pulses Ablation of Fused Silica

Effective Damage Indicator for Aluminum Alloy (AA6082Zr) Processed by ECAE

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Grinding Characteristics, Material Removal, and Damage Formation Mechanisms of Zirconia Ceramics in Hybrid Laser/Grinding

An Eulerian Orthogonal Cutting Model for Unidirectional Fiber-Reinforced Polymers

Formability Prediction for Tube Hydroforming of Stainless Steel 304 Using Damage Mechanics Model

Adaptive Grinding Process—Prevention of Thermal Damage Using OPC-UA Technique and In Situ Metrology

Predicting Sheet Forming Limit of Aluminum Alloys for Cold and Warm Forming by Developing a Ductile Failure Criterion

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Analysis on the Effects of Grinding Wheel Speed on Removal Behavior of Brittle Optical Materials

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