Laser forming (LF) is a non-traditional forming process that does not require hard tooling or external forces and, hence, may dramatically increase process flexibility and reduce the cost of forming. While extensive progress has been made in analyzing and predicting the deformation given a set of process parameters, few attempts have been made to determine the laser scanning paths and laser heat conditions given a desired shape. This paper presents a strain-based strategy for laser forming process design for thin plates with varying thickness, which is utilized in determining the scanning paths and the proper heating conditions. For varying thickness plates, both the in-plane membrane strain and the bending strain need to be accounted for in process design. Compared with uniform thickness plate, the required bending strain varies with not only the shape curvature but also with the plate thickness. The scanning paths are determined by considering the different weight of bending strain and in-plane strain. A thickness-dependent database is established by LF finite element analysis simulation, and the heating conditions are determined by matching the ratio of bending strain to in-plane strain between the required values and the laser forming values found in the database. The approach is validated by numerical simulation and experiments using several typical shapes.
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e-mail: pc2052@columbia.edu
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August 2006
Technical Papers
Laser Forming of Varying Thickness Plate—Part II: Process Synthesis
Peng Cheng,
Peng Cheng
Department of Mechanical Engineering,
e-mail: pc2052@columbia.edu
Columbia University
, New York, NY 10027
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Yajun Fan,
Yajun Fan
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
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Jie Zhang,
Jie Zhang
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
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Y. Lawrence Yao,
Y. Lawrence Yao
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
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David P. Mika,
David P. Mika
Global Research Center,
General Electric Company
, Niskayuna, NY
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Wenwu Zhang,
Wenwu Zhang
Global Research Center,
General Electric Company
, Niskayuna, NY
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Michael Graham,
Michael Graham
Global Research Center,
General Electric Company
, Niskayuna, NY
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Jud Marte,
Jud Marte
Global Research Center,
General Electric Company
, Niskayuna, NY
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Marshall Jones
Marshall Jones
Global Research Center,
General Electric Company
, Niskayuna, NY
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Peng Cheng
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027e-mail: pc2052@columbia.edu
Yajun Fan
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
Jie Zhang
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
Y. Lawrence Yao
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
David P. Mika
Global Research Center,
General Electric Company
, Niskayuna, NY
Wenwu Zhang
Global Research Center,
General Electric Company
, Niskayuna, NY
Michael Graham
Global Research Center,
General Electric Company
, Niskayuna, NY
Jud Marte
Global Research Center,
General Electric Company
, Niskayuna, NY
Marshall Jones
Global Research Center,
General Electric Company
, Niskayuna, NYJ. Manuf. Sci. Eng. Aug 2006, 128(3): 642-650 (9 pages)
Published Online: November 12, 2005
Article history
Received:
November 7, 2005
Revised:
November 12, 2005
Connected Content
A companion article has been published:
Laser Forming of Varying Thickness Plate—Part I: Process Analysis
Citation
Cheng, P., Fan, Y., Zhang, J., Yao, Y. L., Mika, D. P., Zhang, W., Graham, M., Marte, J., and Jones, M. (November 12, 2005). "Laser Forming of Varying Thickness Plate—Part II: Process Synthesis." ASME. J. Manuf. Sci. Eng. August 2006; 128(3): 642–650. https://doi.org/10.1115/1.2162912
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