... illustrate the methodology through selected examples, with a focus on information technology systems. 25 08 2010 23 05 2011 13 01 2012 13 01 2012 design engineering finite element analysis heat transfer micromechanical devices optimisation transport processes reduced...

... micromechanical devices nanofabrication nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) heat pipe electronic cooling evaporation The thermal management of high-power-density semiconductor devices...

.... convection cooling foams heat sinks microfabrication micromechanical devices two-phase flow 07 03 2011 07 03 2011 2011 American Society of Mechanical Engineers ...

... include the axial length, temperature range, mass flow rate, and working fluid. 04 02 2009 01 10 2009 10 08 2010 10 08 2010 cryogenics flow through porous media heat exchangers heat transfer micromechanical devices plates (structures) perforated plate heat exchanger...

... , Melville, NY . 18 05 2009 10 12 2009 28 04 2010 28 04 2010 elemental semiconductors finite element analysis heat conduction micromechanical devices Raman spectra silicon thermometers Raman thermometry MEMS finite element heat conduction simulations...

... annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure In new-generation microelectronic systems, the increase in power dissipation requires compact...

... 2009 26 08 2009 heat transfer jets micromechanical devices orifices (mechanical) electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient Due to the increasing power consumption and decreasing size of electronic chips, cooling...

... 03 2009 forced convection heat exchangers lithography microchannel flow micromechanical devices silicon sputter etching microchannel cooler constructal theory fractal geometry constructal trees electronic cooling single phase forced convection GaN SiC In recent...

... apparent thermal conductivity than a silica aerogel, which has an apparent thermal conductivity of 0.03   W / m   K when the cold-side temperature is 294 K ( 5 ). micro-insulation MEMS microscale cells (electric) heat conduction insulation micromechanical devices...

... 2008 11 02 2009 micromechanical devices silicon thermal conductivity thermal conductivity 3ω technique polycrystalline silicon suspended microbridge thermal boundary resistance The characteristic lengths of material features contained in microelectronic devices...

... adjusted and controlled. They are widely used as thermal flow sensors, microbolometers, Joule heating igniters, infrared sources, gas sensors, etc. ( 1 2 3 4 ). contact resistance thermal probes calibration thermocouple microhotplate calibration contact resistance micromechanical...

... micromechanical devices nucleate boiling bubble behavior MEMS artificial cavity Since boiling heat transfer has a high heat transfer coefficient, it has been used as a cooling technique for high-temperature bodies. The boiling phenomena have been investigated for more than 60 – 70 years...

... transfer latent heat mass transfer membranes microfluidics micromechanical devices polymers supports microtruss architecture latent heat transfer mass transfer pore diffusion MEMS nanotechnology membrane polymers soft materials evaporation nonboiling evaporative cooling phase...

... that multiple-phonon processes are contributing to interfacial transport at high temperatures. 24 07 2006 14 06 2007 04 02 2008 alumina aluminium chromium dielectric materials interface phonons micromechanical devices phonon-phonon interactions platinum silicon thermal...

.... Preliminary experimental results show that the temperature drop is inline with that theoretically predicted. 02 02 2006 14 08 2006 thermal analysis micromechanical devices temperature control aerospace components lightweight structures temperature distribution laser materials...

... ,” Appl. Phys. Lett. 0003-6951 10.1063/1.114125 , 66 ( 26 ), pp. 3639 – 3641 . 17 01 2006 31 05 2006 silicon elemental semiconductors micromechanical devices coherent antiStokes Raman scattering spectral line breadth thermal stresses calibration spectral methods...

... evaporation heat pipes LIGA cooling channel flow micromechanical devices gravity lithography electrodeposition Channel Flow Evaporation Heat Transfer Heat Pipes Microscale Evaporative cooling devices such as heat pipes and capillary pumped loops utilize capillary suction to draw...

... Transfer Division for publication in the JOURNAL OF HEAT TRANSFER . Manuscript received by the Heat Transfer Division April 26, 2001; revision received October 18, 2001. Associate Editor: G. P. Peterson. 26 April 2001 18 October 2001 silicon bubbles resistors micromechanical...

... August 6, 2001. Associate Editor: A. Majumdar. 18 December 2000 06 August 2001 adhesion micromechanical devices laser beam applications high-speed optical techniques maintenance engineering stiction Experimental Laser Microscale Microstructures Surface Adhesion...