Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-1 of 1
Keywords: high power density
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
E. G. Colgan, B. Furman, M. Gaynes, N. LaBianca, J. H. Magerlein, R. Polastre, R. Bezama, K. Marston, R. Schmidt
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2007, 129(8): 1046–1051.
Published Online: October 17, 2006
... the maximum chip
junction to the outlet as about 10 C mm 2 ∕ W . Twenty five years ago, Tuckerman and Pease first described the use of
microchannel cooling for very high power densities ( 4 ). They demonstrated cooling of 790 W ∕ cm 2...
