A simplified analytical model for the computation of thermal conduction across rectangular-celled enclosures based on the assumption of quasi-one-dimensional conduction in the cell partitions is presented. The rectangular enclosures may contain solid or liquid for which the conduction is two or three-dimensional depending on the geometrical configuration. Additional assumptions concerning radiation interchange between participating surfaces are necessary when the enclosure contains a stagnant gas. This analytical model leads to a closed form solution for temperature distribution in the partitions and the multidimensional conductive region. A parametric study of heat flux is presented. The numerical data define a range of parameters for which a one-dimensional conduction model is satisfactory.
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Conduction of Heat across Rectangular Cellular Enclosures
J. Eftekhar,
J. Eftekhar
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
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G. Darkazalli,
G. Darkazalli
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
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A. Haji-Sheikh
A. Haji-Sheikh
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
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J. Eftekhar
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
G. Darkazalli
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
A. Haji-Sheikh
Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.
J. Heat Transfer. Aug 1981, 103(3): 591-595 (5 pages)
Published Online: August 1, 1981
Article history
Received:
July 10, 1980
Online:
October 20, 2009
Citation
Eftekhar, J., Darkazalli, G., and Haji-Sheikh, A. (August 1, 1981). "Conduction of Heat across Rectangular Cellular Enclosures." ASME. J. Heat Transfer. August 1981; 103(3): 591–595. https://doi.org/10.1115/1.3244507
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