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Journal Articles

Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)

Chandra S. Desai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045501.
https://doi.org/10.1115/1.4000901
Published Online: October 25, 2011
... analysis based on trapezoidal cycles to support the statements presented in the paper OR state that additional research would be required to support this conclusion . compressive strength solders yield strength 14 01 2006 21 12 2009 25 10 2011 25 10 2011 ...
View Article titled, Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
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Topics: Electrons, Modeling, Solders
Journal Articles

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Mithilesh Shah, Kaiyang Zeng, Andrew A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
https://doi.org/10.1115/1.1648062
Published Online: April 30, 2004
.... The elastic modulus varied independent of the microstructure. A yield stress profile based on empirical hardness-yield strength correlation is predicted for the wirebond. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript...
View Article titled, Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Open the PDF for Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation in another window
Topics: Heat, Nanoindentation, Recrystallization, Stress, Wire, Secondary ion mass spectrometry, Temperature, Bonding, Elastic moduli, Manganese (Metal)