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Keywords: underfill
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Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
...Byung-Seung Yim; Young-Eui Shin; Jong-Min Kim In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
Published Online: June 12, 2017
... analysis Underfill Three-dimensional integrated circuits (3D ICs) are fabricated by stacking multiple devices or die together and making interconnection between them [ 1 , 2 ]. There are several advantages of 3D ICs compared to traditional two-dimensional ICs. For example, the overall system...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
Published Online: June 12, 2017
... and discussed here. More specifically, different fracture characterization techniques on (a) freestanding “thin” solder-resist films and (b) filled “bulk” epoxy materials such as underfills and epoxy mold compounds are investigated. For thin films, learnings from different test methods for measuring fracture...
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
Published Online: October 21, 2016
... of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gradients, this publication will provide an overview of several studies on the formation of sequential thermal underfills that result in percolation and quasi-areal thermal...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030802.
Paper No: EP-16-1052
Published Online: July 25, 2016
...John H. Lau Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
...)00105-3 Li , H. Y. , Jacob , K. I. , and Wong , C. P. , 2003 , “ An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages ,” IEEE Trans. Adv. Packag. 1521-3323 , 26 ( 1 ), pp. 25 – 32 . 10.1109/TADVP.2003.811546 Procter , P. , and Solc...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 48–55.
Published Online: May 13, 2006
...Chao-Ming Lin; Win-Jin Chang; Te-Hua Fang This study aims to enhance the flow rate and reduce the filling time in flip-chip underfill packaging by combining capillary force, pressure difference, and inertia effects. In the designed underfill apparatus, the capillary force effect is developed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... of the surface laminar layer and the embedded microstructures. The displacement fields are analyzed to produce the deformed configuration of the surface laminar layer and the strain distributions in the microstructures. The high modulus of underfill produces a strong coupling between the chip and the surface...