1-20 of 23
Keywords: thermal management
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
Published Online: March 30, 2023
... used temperature control techniques include air cooling [ 27 ], liquid cooling [ 28 ], phase change materials [ 29 , 30 ], heat pipes [ 31 ], thermoelectric coolers [ 32 ], and composite cooling schemes [ 33 ]. Among them, thermoelectric coolers are widely used in thermal management systems...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
... inside the motor. In order to improve thermal management, a multiphysics modeling framework that is able to accurately predict the behavior of the motor, while being computationally efficient, is essential. This paper first presents a detailed validation of a lumped parameter thermal network (LPTN) model...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
Published Online: October 13, 2021
... , “ Evaporation Dynamics of a Sessile Droplet on Glass Surfaces With Fluoropolymer Coatings: Focusing on the Final Stage of Thin Droplet Evaporation ,” Soft Matter , 14 ( 10 ), pp. 1811 – 1821 . 10.1039/C7SM02192E [15] King , C. R. , Jr , 2012 , Thermal Management of Three-Dimensional...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... for an extensive range of thermal-management applications, ranging from aerospace, spacecraft, and smart-building construction materials, to electronics protection, electronics packaging, refrigeration, thermal control during energy harvesting, thermal isolation, etc. This work extends the vapor-chamber...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
Published Online: June 29, 2020
... mechanisms that are adapted and optimized for the time constants and needs of the specific application. It is the intent of this transient thermal management review to describe a wide range of areas in which transient thermal management for electronics is a factor of significance and to illustrate which...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
Published Online: June 29, 2020
... successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021009.
Paper No: EP-18-1078
Published Online: March 19, 2020
...Yogesh Fulpagare; Atul Bhargav; Yogendra Joshi With the explosion in digital traffic, the number of data centers as well as demands on each data center, continue to increase. Concomitantly, the cost (and environmental impact) of energy expended in the thermal management of these data centers...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
Published Online: May 8, 2019
... ), Bucharest, Romania , Oct. 23–26 , pp. 35 – 37 . 10.1109/SIITME.2014.6966989 [19] Malu , N. , Bora , D. , Nakanekar , S. , and Tonapi , S. , 2014 , “ Thermal Management of an IGBT Module Using Two-Phase Cooling ,” 14th Intersociety Conference on Thermal and Thermomechanical Phenomena...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
.... Their study showed that a slight change in the operating point on the CRAC blower characteristic curve leads to significant change in the flow rate. Different modeling methods are used in data center thermal management. The method depends on the level of modeling (i.e., server level, rack level, and room...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
Published Online: May 12, 2014
... built and a comprehensive experimental study is conducted to validate the proposed model. The experimental results show great agreement, less than 4.5% relative difference in comparison with the modeling results. thermal management passive cooling system RC network modeling dynamic loading...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
Published Online: March 28, 2013
.... , 130 ( 1 ), p. 011006 . 10.1115/1.2837524 [6] Mohammadi , N. , Mohammadi , M. , and Shafii , M. B. , 2012 , “ A Review of Nanofluidic Pulsating Heat Pipes: Suitable Choices for Thermal Management of Electronics ,” Front. Heat Pipes , 3 ( 3 ), p. 033001 . 10.5098/fhp.v3.3.3001...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
...Peipei Li; Jing Liu Thermal management has been a critical issue for the safe running of an electronic device. Driving liquid metal with low melting point to extract heat from the thermal source is highly efficient because of its superior thermophysical properties over conventional coolant...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
Published Online: September 9, 2010
... Piezoelectric Fans for Cooling Light Emitting Diodes ,” Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , IEEE, New York, pp. 663 – 671 . Ma , K. Q. , and Liu , J. , 2007 , “ Liquid Metal Cooling in Thermal Management of Computer Chips ,” Front...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... , L. -T. , and Chu , R. C. , 2002 , Thermal Management of Microelectronic Equipment , ASME , New York . Lofland , S. J. , and Chesser , J. B. , 2003 , “ Heat Sink With Heat Pipes and Fan ,” U.S. Patent No. 6,625,021 B1 . Yovanovich , M. M. , Muzychka , Y. S...