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Journal Articles

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
https://doi.org/10.1115/1.2070048
Published Online: March 21, 2005
...Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontia; Antonio Paesano; Subhotosh Khan; John W. Gillespie, Jr. The objective of this study is to describe and evaluate test methods developed to experimentally characterize the in situ mechanical behavior of solder ball arrays connecting printed wiring...
View Article titled, <span class="search-highlight">Test</span> Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C
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Topics: Printed circuit boards, Shear (Mechanics), Solders, Stress
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
... properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From...
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability <span class="search-highlight">Test</span>
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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion
Journal Articles

Coatings Technology Handbook, Second Edition

D. Satas,, Editor,, Arthur A. Tracton,, Editor, and, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2002, 124(1): 67–68.
https://doi.org/10.1115/1.1446069
Published Online: March 1, 2002
...D. Satas,, Editor,; Arthur A. Tracton,, Editor, and; Anthony J. Rafanelli, Reviewer coating techniques reviews testing Coatings Technology Handbook, Second Edition , edited by D. Satas and Arthur A. Tracton, Marcel-Dekker, Inc., New York, 2001, 902 pp., ISBN: 0-8247-0439-8, $225.00...
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Topics: Coatings, Testing