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Keywords: split Hopkinson tensile bar
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
... were investigated using the split Hopkinson tensile bar experimental technique. Stress-strain curves of the three solders were obtained, and microstructure and fractography of the specimens before and after the tests were examined and presented. The experimental results show that the lead-free solders...
