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Keywords: solid state bonding
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
...Chu-Hsuan Sha; Chin C. Lee Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure applied. This is a solid-state bonding without any molten phase involved. The Au layer...