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Keywords: sodium compounds
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
Published Online: June 1, 2001
...Yunsheng Xu,; Xiangcheng Luo, and; D. D. L. Chung In the above paper, p. 130, in the title of Table 1, cm should be changed to m in the denominator of the unit for thermal contact conductance. sodium compounds thermal conductivity interface phenomena 2001 ASME ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 128–131.
Published Online: December 28, 1999
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 27, 1999; revision received December 28, 1999. Associate Technical Editor: D. Agonafer. 27 July 1999 28 December 1999 sodium compounds thermal conductivity interface phenomena Insufficiently fast...