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Keywords: sintered silver paste
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
Published Online: November 22, 2021
... to about 150 °C. In this paper, the leadless package structure is designed using pressure conduction on the backside of the chip and replacing the gold wire with sintered silver paste. The materials and dimensions of the leadless package structure are determined and then obtained a complete package...