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Keywords: simulation
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
Published Online: April 22, 2022
... by covering with the molding layer. Finite element method simulation is conducted to analyze the mechanical stress distribution of the flexible package with and without molding layer during bending deformation. This study based on experimental results and simulation analysis can provide helpful guidelines...
Includes: Supplementary data
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
Published Online: June 4, 2020
..., resulting in poor heat dissipation performance for LED filament lamps. A numerical simulation model of the typical LED filament lamp was established to simulate and analyze the heat dissipation and airflow phenomenon of LED filament lamps in this study. In addition, increasing lamp sizes, increasing...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021008.
Paper No: EP-12-1104
Published Online: March 28, 2013
... were less than 1 × 10 −6 . The preprocessor software icem cfd was used to generate meshes for all cases, and the structured mesh was applied. To get simulation results independent of the mesh size, a systematic method was carried out to verify the mesh independence. Due to the three...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011006.
Published Online: March 19, 2012
.... With the measured data of temperatures and airflow velocities, the mathematic model is constructed using a commercial Computational Fluid Dynamics (CFD) software and experimental data to present a comparison between test results and numerical simulations. The area of the data center is 311 square meters...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
... solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing process can be divided into the following...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
Published Online: December 12, 2002
..., the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were...