1-6 of 6
Keywords: silver
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
Published Online: January 8, 2014
..., 2014. Assoc. Editor: Yi-Shao Lai. 02 07 2013 02 12 2013 Two copper (Cu) substrates were bonded using silver (Ag) and indium (In) and annealed at 200–250 °C to convert the joints into the solid solution (Ag) for enhanced strength and ductility. Cu–Cu pair was chosen so...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
...Chu-Hsuan Sha; Chin C. Lee Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are fabricated on 2-in. Si wafers which are first coated with chromium (Cr)/gold (Au) dual...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
... compounds palladium compounds photoacoustic effect silicon silver thermal conductivity welds In this study, CNT TIMs enhanced with Pd nanoparticles were fabricated using a previously developed method for CNT synthesis and a new process for bonding interfaces using Pd hexadecanethiolate...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
... of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn 3 Ag 0.5 Cu solder, and silver epoxy are aged under hygrothermal...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
...Pin J. Wang; Jong S. Kim; Chin C. Lee A novel process of bonding silver (Ag) foils to copper (Cu) substrates has been developed. This direct bonding method does not use any intermediate layer in between. An important application of this process is electronic packaging where semiconductor device...