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Keywords: recrystallisation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
