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Journal Articles

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
https://doi.org/10.1115/1.2070048
Published Online: March 21, 2005
... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...
View Article titled, Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C
Open the PDF for Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C in another window
Topics: Printed circuit boards, Shear (Mechanics), Solders, Stress
Journal Articles

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
https://doi.org/10.1115/1.2070049
Published Online: December 21, 2004
...Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontia; Antonio Paesano; Subhotosh Khan; John J. Gillespie, Jr. The objective of this work was to experimentally determine the in situ creep behavior and constitutive model equations for a commercial area array package and printed wiring board assembly...
View Article titled, Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C
Open the PDF for Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C in another window
Topics: Creep, Relaxation (Physics), Solders, Stress, Temperature, Shear (Mechanics), Modeling, Solder joints