..., and photolithography, as well as dry and wet etching of Si and SiO 2 . We have used electron-beam (e-beam) lithography and lift-off processes to define the nanoscale structures, and photolithography with both lift-off and wet etching to define microscale structures. Lift-off processes have the capability...

...-to-substrate interconnect can facilitate wafer-level probing as well as wafer-level packaging without the need for an underfill. The fabrication of the G-Helix interconnect is similar to conventional IC fabrication process and is based on electroplating and photolithography. G-Helix interconnect has good...