...Joshua Kasitz; Muhammad Ghufran; David Huitink Passive cooling through phase change materials (PCM) creates beneficial complimentary cooling techniques aimed at providing thermal gradient mitigation during device operation without additional power requirements. These have been well studied...

... and phase change material (PCM). The efficient heat dissipation of the constructed topology optimization model and the effectiveness of the proposed method are verified. 1 Corresponding author. e-mail:  yzm@swjtu.edu.cn 08 07 2023 04 11 2023 11 12 2023 topology optimization...

...Michael Deckard; Darin J. Sharar; Michael Fish; Patrick J. Shamberger Phase change materials (PCMs) can provide thermal buffering to systems that experience transient heat loads, including electronics and optoelectronics packaging. Placing the PCM in the primary path of heat rejection decreases...

... Histogram of SiC die time at temperature in single-sided (a) and dual-sided package (b) throughout US06 drive cycle As shown in the Impact of Phase Change Material Selection and Placement section, dual-sided cooling improves the performance by reducing the thermal resistance from the junction...

... o = contact pcm = phase change material wf = working fluid Greek Symbols β = thermal expansion coefficient (°C −1 ) δ = wick thickness (mm) λ = latent heat J/kg ν = kinetic viscous coefficient (m 2 /s) σ = surface tension coefficient...

...Mustapha Faraji; Hamid El Qarnia The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane...