... encapsulation filled polymers particle size permittivity sieving silicon compounds thermal conductivity thermal conductivity polymer composite ceramic filler dielectric properties Thermally conductive but electrically insulating, also for their cost effectiveness and design flexibility...

... the stress exceeds ∼ 7 MPa . The relative dielectric constant is higher during loading than subsequent unloading. 24 08 2004 24 08 2004 alumina permittivity electronics packaging compressive strength stress analysis thermal stresses Alumina (aluminum oxide, Al 2 O 3...

... degradation dielectric losses Young's modulus bending thermal expansion finite element analysis permittivity reliability The LCP has very attractive properties that include low dielectric constant, very low moisture absorption, excellent thermal and dimensional stability and a thermal expansion...

... films permittivity surface topography atomic force microscopy surface chemistry X-ray photoelectron spectra integrated circuit technology As polymer dielectric materials appear to be the immediate successor to oxide interlevel dielectrics (ILDs), industry and academia have begun...