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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
Published Online: July 7, 2022
...Hao-hang Su; Shuai Fu; Su-yuan Li; Jiang Bian Aiming at the failure problem of aerospace electronic product at the complex space environment, the electrothermal coupling method has been used to analyze the reliability of the ten channels independently adjustable voltage conversion system in package...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
Published Online: April 22, 2022
... is of single electronic components or simple devices, such as metal interconnect, transparent conductive electrode, or thin-film devices, rather than that of the real package sample having complex structure and various materials. This study systematically investigated the mechanical reliability of flexible Si...
Includes: Supplementary data