...Mithilesh Shah; Kaiyang Zeng; Andrew A. O. Tay The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ due to recrystallization and grain growth. For our...

... to a 85% relative humidity and 85°C temperature (85%RH/85°C) test condition. Also, the average light optical power, receiver sensitivity, extinction ratio, and mask margin of transceiver modules subjected to 85%RH/85°C and 3.47V at 500, 1000, 1500, and 1600 h are provided. Furthermore, metallography...

... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...