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Keywords: junction temperature
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
Published Online: July 25, 2024
... the reliability increase as a result of maintaining constant junction temperatures with the active jet impingement scheme. This study examined the construction, characterization, and experimental validation of a variable area nozzle jet impingement cooler. A voice coil motor was used to actuate an optical iris...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
...Yutaka Kumano; Tetsuyoshi Ogura; Toru Yamada A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective...