... structure through manufacturing. The reliability of the leadless package structure after silver paste sintering was verified by finite element analysis, and the results showed that the thermal stress caused by high and low-temperature cycles in the leadless package is minimal and does not affect...

... 2021 3D-ICs packaging through silicon via finite element analysis fatigue lifespan estimation Ministry of Science and Technology, Taiwan 10.13039/501100004663 MOST 106-2221-E-007-126-MY3 Advanced packaging technologies with high-density nanoscaled transistors need...

..., the analytical solution could be obtained for different radius R and width w as shown in Table 3 . And the numerical solution by finite element analysis was also calculated and shown in Table 3 . The analytical solution correlates very well with the FEA results. However, there is slight deviation due...

.... In the models of straight and barrel interconnects as the typical solder bumps in modern flip-chip technology, the critical current density is predicted through calculating electrical potential by proposed formulation and simulation based on the finite element analysis (FEA). The critical current density...

... of their substantial weight and the fragility of the internal modules. For product design, it is essential to understand the impact failure mechanism of the products. In this study, a compression test, a drop impact test, and a finite element analysis (FEA) were performed to analyze the dynamic behaviors of a packaged...

... filled with interface material) on the resulting thermal-structural response is investigated with respect to four interface materials combinations, and it is found that the thermal performance is most sensitive to the slot-depth compared to any other parameter. pin fin finite element analysis...

... resistance of ACA particles and make them stable and reliable, it is important to take the current bending effect into consideration and control the particle diameter and the bonding force properly. anisotropic conductive adhesive bulk resistance potential distribution finite element analysis...

... at micrometer level has not been possible using conventional techniques. In the present study, an efficient and accurate multi-level thermal modeling and analysis technique has been developed. The technique combines finite element analysis sub-modeling and a superposition method for more efficient modeling...

... experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested. 29 06 2010 19 10 2011 19 12 2011 19 12 2011 electronics packaging finite element analysis hardening semiconductor...

...) 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections, the flip-chip connection has become important in high-performance packages due to its high density and low inductance, compared...

... device manufacture electronic products finite element analysis reliability transient response vibrations Designers have long realized the benefits of effective modeling and simulation during the design cycle. In particular, during the last decade, designers of portable electronic systems...

... )]. These empirical results will be used in future work to develop and calibrate finite element analysis (FEA) methodology for dynamic response analysis, to facilitate durability assessment under shock and drop excitation. The rest of this paper is organized as follows: first system under study is described...

... the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...

...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...

... is briefly exposed and the method is applied to some two-layer virtual structures. The obtained results are compared with those obtained using standard FEM analyses. electronics packaging finite element analysis power electronics thermal analysis Thanks to all these facilities the DJOSER...

... is presented, damage propagation path and pattern are compared with typical experimental results, and the accuracy of the model was verified. 17 03 2010 08 07 2010 08 12 2010 08 12 2010 fatigue cracks finite element analysis solders viscoplasticity Low cycle fatigue...

... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...

... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...

... properties, fillet height, and silicon die thickness on the interface delamination between epoxy molding compound and silicon die during a lead-free solder reflow process based on the modified virtual crack closure method. Based on finite element analysis and experiment study, it can be concluded...

... 04 03 2010 04 03 2010 finite element analysis integrated circuit reliability solders wafer level packaging Wafer-level chip scale packages (WCSPs) are gaining momentum in the market place recently ( 1 ). This is mainly due to low cost and good electrical performance. From...