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Keywords: fatigue model
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... that at room temperature (25°C). Finite element analysis modeling and simulation were performed for different test conditions to investigate the solder joint stress-strain behavior. Volume-averaged energy density was used as a fatigue damage parameter and energy-based bending fatigue models were developed...
