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Journal Articles

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
https://doi.org/10.1115/1.2070048
Published Online: March 21, 2005
... to the projected shape of the ball grid array to achieve uniform loading. Tension, compression, and shear tests were conducted. For tensile loading the interfaces and the solder balls are loaded in series resulting in a large apparent strain (13%). Various interfacial failure modes are observed. Under compression...
View Article titled, Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C
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Topics: Printed circuit boards, Shear (Mechanics), Solders, Stress