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Keywords: encapsulant
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041120.
Paper No: EP-24-1041
Published Online: September 30, 2024
... but are difficult to implement due to complications concerning effective enclosure of the liquid phase. Encapsulated PCM particles can be embedded in other materials to form composites with form stable solid–liquid phase transitions. This study characterizes a new composite of silicone gel and encapsulated phase...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 30, 2017; final manuscript received March 16, 2018; published online May 10, 2018. Assoc. Editor: Amy Marconnet. 30 04 2017 16 03 2018 Electronic Encapsulant Harsh...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031007.
Paper No: EP-16-1120
Published Online: July 10, 2017
...Yowching Liaw; Jung-Hua Chou Encapsulation molding compounds (EMCs) are commonly used to protect integrated circuit (IC) chips. Their composition always contains fillers of a large amount (about 70%) and will affect the properties of the compounds. Thus, in order to clarify the filler effects...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
Published Online: October 21, 2009
..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. composite materials electronics packaging finite element analysis polymers thermal conductivity composite materials thermal analysis encapsulant underfill finite element...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
Published Online: July 30, 2008
... encapsulant gels was characterized. Consistent results for most gels were obtained to the fifth significant digit, confirming the high precision capabilities of this simple technique. Accurate information on Poisson’s ratio may be required for elastomeric materials that are used in constrained configurations...