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Keywords: electromagnetic interference
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2007, 129(2): 216–218.
Published Online: September 5, 2006
...Marc Hodes; Cristian Bolle; Paul Kolodner We describe a technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an external airflow through openings in the lid of the shield...