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Keywords: cyclic bend test
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... alloys cyclic bend test fatigue model lead-free solder Sn–Ag–Cu For the past few years, the very-thin quad flat no-lead (VQFN) package became very popular in portable electronics due to its many advantages of excellent electrical and thermal performance, small footprint and profile...
