... used, the yield surfaces for each can be different. This is analogous to the well-known and classical Mohr-Coulomb model (for geologic materials) where the strength envelope is valid for compression and not for tension because the tensile strength is different from the compressive strength. Similarly...

...–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys. 09 12 2009 14 09 2010 23 11 2010 23 11 2010 compressive...

... the stress exceeds ∼ 7 MPa . The relative dielectric constant is higher during loading than subsequent unloading. 24 08 2004 24 08 2004 alumina permittivity electronics packaging compressive strength stress analysis thermal stresses Alumina (aluminum oxide, Al 2 O 3...

... polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding compounds affect the mechanical reliability of microelectronic...