Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-2 of 2
Keywords: chips
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
Published Online: March 21, 2005
... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...
Journal Articles
Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... at − 40 , 23, and 125 °C through shear loading. The chip is connected to the printed circuit board by means of solder joints made of 62%Sn–36%Pb–2%Ag alloy. It was shown that the creep rate of solder ball arrays could be investigated using a stress relaxation method. Under the shear relaxation mode...