1-6 of 6
Keywords: chip cooling
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
Published Online: April 29, 2014
... micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices. pin-fin microchannel varying high heat flux chip cooling infrared Breakthroughs in many of today's technologies are becoming increasingly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
.... , 2006 , “ Water-and-Dust Proof Structure for a Notebook Computer Heat Sink ,” U.S. Patent No. 0,262,507 A1. 8 Liu , J. , and Zhou , Y. X. , 2002 , “ A Computer Chip Cooling Method Which Uses Low Melting Point Metal and Its Alloys as the Cooling Fluid ,” China Patent No. 021314195...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
Published Online: September 9, 2010
.... , 2009 , “ On-Chip Cooling by Superlattice-Based Thin-Film Thermoelectrics ,” Nat. Nanotechnol. 1748-3387 , 4 , pp. 235 – 238 . 10.1038/nnano.2008.417 Nguyen , C. T. , Roy , G. , Gauthier , C. , and Galanis , N. , 2007 , “ Heat Transfer Enhancement Using Al2O3-Water...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
Published Online: February 13, 2009
... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 427–431.
Published Online: November 15, 2005
..., specific surface area, thermal conductivity, and surface wetability of the working fluid. vapor chamber graphite foam heat spreader chip cooling cooling integrated circuit packaging thermal conductivity thermal resistance graphite 30 09 2005 15 11 2005 2006...
Journal Articles