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Keywords: channel flow
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
... essentially unaltered. 11 07 2011 07 09 2011 17 11 2011 17 11 2011 channel flow convection cooling emissivity radiative transfer thermal analysis thermal conductivity walls thermal analysis air cooling conjugate heat transfer discrete heat sources Rapid...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
Published Online: February 13, 2009
... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
Published Online: December 13, 2006
... to Microchannels ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. 0148-6411 10.1109/33.180049 , 15 ( 5 ), pp. 832 – 842 . Incropera , F. P. , and DeWitt , D. P. , 1996 , Introduction to Heat Transfer , 3rd ed. , John Wiley & Sons , New York. channel flow cooling heat sinks...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 172–178.
Published Online: July 21, 2006
... and simulations were carried out to verify the model effectiveness as well as to investigate the performance of the rotary screw dispensing process. 04 01 2006 21 07 2006 electronics packaging channel flow Fluid dispensing is a method to deliver fluid materials in a controlled...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 150–156.
Published Online: November 30, 2005
...D. Rundström; B. Moshfegh The current trends toward the greater functionality of electronic devices are resulting in a steady increase in the amount of heat dissipated from electronic components. Forced channel flow is frequently used to remove heat at the walls of the channel where a PCB...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
Published Online: August 18, 2005
... sintering heat conduction integrated circuit packaging thermal management (packaging) channel flow The integrated circuit (IC) industry is manufacturing denser and more powerful products, thus necessitating a better cooling technology to prevent the demand from heat dissipation devices...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 474–482.
Published Online: March 18, 2005
... 03 2005 thermal management (packaging) heat sinks channel flow liquid crystals forced convection cooling In recent years, heat sink is the most common thermal management hardware in use in the electronics industry. From the existing literature survey ( 1 2 3 4 ), the extensive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 172–177.
Published Online: December 23, 2004
... on the thermal resistance of the heat sink is discussed. Detailed measurements on an instrumented heat sink estimate that the average heat transfer coefficients in the channel flow between the fins is 2.5 times that of a steady flow in the ducts at the same Reynolds Number. This work was supported by DARPA’s...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
Published Online: December 17, 2004
... procedure. 25 02 2004 17 12 2004 thermal management (packaging) heat sinks integrated circuit packaging two-phase flow microfluidics channel flow coolants Thermal engineers in the electronics industry are facing unprecedented challenges of removing enormous amounts of heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 288–300.
Published Online: October 6, 2004
... never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Features unique to two-phase micro-channel flow were identified and employed to validate key assumptions of an annular flow boiling model that was previously developed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
Published Online: August 9, 2004
... natural convection channel flow laminar flow water In the thermal management of high-power electronic chips, liquid cooling has been considered to replace air cooling as increasing power density makes it difficult to maintain reasonable chip wall temperatures to below 85 ° C . Although...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
... at 60 °C for 1 h. Then, Teflon tubes were pulled out and PDMS was peeled off. PDMS film adheres on the Pyrex substrate to encapsulate the fabricated microchannel. 03 09 2003 09 08 2004 silicon compounds alumina microfluidics micromachining channel flow electrophoresis...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
Published Online: August 5, 2004
... including the height, size, and spacing of the roughness elements on the Poiseuille number. The fluid temperature effects are also investigated numerically for the rough channels. 06 04 2004 05 08 2004 channel flow microfluidics Poiseuille flow friction surface roughness thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
Published Online: July 8, 2004
... examined and deemed unsuitable for micro-channel heat sinks because all these correlations are based on turbulent flow assumptions, and do not capture the unique features of micro-channel flow such as abrupt transition to slug flow, hydrodynamic instability, and high droplet entrainment in the annular...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
Published Online: September 17, 2003
... cooling channel flow two-phase flow power semiconductor devices Several cooling schemes have been developed in recent years to combat the large increases in heat dissipation from electronic and power devices. Air-cooled heat sinks are presently found in most personal computers, but are rapidly...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 200–207.
Published Online: June 10, 2003
... convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow Design is the permanent struggle for better and better global system performance, under imposed constraints. This paper reviews a body of electronics cooling results that illustrate how...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 104–113.
Published Online: March 14, 2003
... exchangers forced convection thermal management (packaging) temperature distribution channel flow 21 December 2001 14 03 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD...