...Brian D. Roggeman; Venkatesh Raghavan; Peter Borgesen The introduction of less compliant lead free solders together with weaker and more brittle laminate materials has led to major concerns with respect to the resistance of the latter to pad cratering. For purposes of laminate selection as well...

... has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes...