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Keywords: bonding processes
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
... g) per column. During bonding, the Ag columns deform and conform to the Cu substrate. They are well bonded to the Cu. No molten phase is involved in the bonding process. The joints consist of pure Ag only. The ductile Ag joints are able to accommodate the thermal expansion mismatch between Si and Cu...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
... and testing process. This experiment evaluates the package reliability due to heat and moisture. 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
Published Online: June 23, 2009
... in warpage introduced by the curing process gave a higher interconnect reliability for the bump bonds. Based on these findings, lower curing temperatures are considered to be more effective for improving the mountability of the package and the interconnect reliability. assembling bonding processes flip...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
... chips and Cu substrates. As a demonstration of using the fabricated Ag–Cu dual layer substrate, a fluxless bonding process is developed, which produces high temperature joints with melting temperatures exceeding 695 ° C . Cross-section SEM image of the joint after the annealing step...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... by the current distribution in the plating cell. The deposition is very selective; only occurring on the exposed bond pad metallization. zincation electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) electronics packaging electroless deposition bonding processes surface...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 48–51.
Published Online: April 30, 2004
...W. Salalha; E. Zussman; P. Z. Bar-Yoseph An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices...