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Keywords: boiling heat transfer
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
Published Online: November 9, 2021
...Cheng-Hui Lin; Yoonjin Won Boiling heat transfer has been a popular topic for decades because of its ability to remove a significant amount of thermal energy while maintaining a low wall superheat during the liquid phase change. Such boiling mechanisms can be tailored by engineering new boiling...
Topics:
Boiling,
Bubbles,
Critical heat flux,
Electrodeposition,
Heat transfer,
Copper,
Dynamics (Mechanics),
Microscale devices,
Fins,
Flow (Dynamics)
Includes: Supplementary data