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Keywords: aerodynamics
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 480–489.
Published Online: December 15, 2003
... of the characterization, as it does not show what aerodynamic or thermal interaction each package will have in a real system. This paper presents a new board-level electronics system test vehicle consisting of an array of ball grid components on three different effective thermal conductivity multi-layer PCB’s...