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Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Accepted Manuscript
Justin Chow, Suresh Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: September 23, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Modeling, Resistors, Silver, Failure, Rupture, Contact resistance, Electrons, Experimental methods, Fillers (Materials)
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Accepted Manuscript
Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: September 23, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Cooling, Heat transfer, Nozzles, Jets, Turbulence, Additive manufacturing, Electronics, Engineering simulation, Fluids, Heat flux
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals

Accepted Manuscript
Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: September 2, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals
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Topics: Anisotropy, Crystals, Solder joints, Stress, Modeling, Failure, Plasticity, Shapes, Solders, Cooling
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
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Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

Hybrid Substrates for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
https://doi.org/10.1115/1.4062993
Published Online: August 11, 2023
View Article titled, Hybrid Substrates for Heterogeneous Integration
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Topics: Bonding, Metals, Solder joints, Reliability, Dielectric materials
Journal Articles

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Xin Wei, Abdallah Alakayleh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011008.
Paper No: EP-23-1011
https://doi.org/10.1115/1.4062894
Published Online: July 21, 2023
View Article titled, Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging
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Topics: Alloys, Creep, Stress, Solder joints, Solders
Journal Articles

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
https://doi.org/10.1115/1.4062828
Published Online: July 14, 2023
View Article titled, Interfacial Fracture Caused by Electromigration at Copper Interconnects
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Topics: Copper, Electrodiffusion, Fracture (Materials), Fracture (Process), Stress, Fracture toughness, Dislocations, Anodes
Journal Articles

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

Accepted Manuscript
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant Narumanchi, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1026
https://doi.org/10.1115/1.4062869
Published Online: June 29, 2023
View Article titled, Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink
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Topics: Cooling, Heat sinks, Manifolds, Silicon, Electronics, Reliability, Thermal management, Additive manufacturing, Algorithms, Copper
Journal Articles

Leadfree Sac Solder Materials Characterization At High Strain Rates At Low Test Temperatures And Drop & Shock Simulation Using Input-G Method

Accepted Manuscript
Pradeep Lall, Vikas Yadav, Jeffrey C. Suhling, David Locker
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: June 29, 2023
View Article titled, Leadfree Sac Solder Materials Characterization At High Strain Rates At Low Test Temperatures And Drop & Shock Simulation Using Input-G Method
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Topics: Materials characterization, Shock (Mechanics), Simulation, Solders, Temperature, Alloys, Storage, Damage, Lead-free solders, Aircraft
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Article titled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
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Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Article titled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component

Markus Tauscher, Tobias Merk, Aniket Adsule, Andreas Linnemann, Jürgen Wilde
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
https://doi.org/10.1115/1.4062404
Published Online: May 15, 2023
View Article titled, Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Solders, Cycles, Deformation
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Article titled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
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Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure

Zong-Tao Li, Jun-Hao Wu, Guan-Wei Liang, Ren-peng Yang, Zhihui Yang, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011001.
Paper No: EP-22-1071
https://doi.org/10.1115/1.4062383
Published Online: May 2, 2023
View Article titled, Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure
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Topics: Columns (Structural), Particulate matter, Reflectance
Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure