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Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Article titled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
https://doi.org/10.1115/1.4033069
Published Online: April 21, 2016
View Article titled, Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
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Topics: Patents, Pressure, Sintering, Bonding, Semiconductors (Materials)
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Article titled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
https://doi.org/10.1115/1.3103947
Published Online: April 2, 2009
View Article titled, High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules
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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
View Article titled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar, David C. Whalley, Ming K. Low
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 338–343.
https://doi.org/10.1115/1.1390341
Published Online: September 3, 2001
View Article titled, IGBT Package Design for High Power Aircraft Electronic Systems
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Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

Failure Estimation of Semiconductor Chip During Wire Bonding Process

T. Ikeda, N. Miyazaki, K. Kudo, K. Arita, H. Yakiyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 85–91.
https://doi.org/10.1115/1.2792672
Published Online: June 1, 1999
View Article titled, Failure Estimation of Semiconductor Chip During Wire Bonding Process
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Topics: Failure, Semiconductors (Materials), Wire bonding, Gallium arsenide, Pressure, Wire, Cycles, Deformation, Electronic packaging, Metals
Journal Articles

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

S. Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 160–167.
https://doi.org/10.1115/1.483149
Published Online: January 11, 1999
View Article titled, Flow Analysis in a Chip Cavity During Semiconductor Encapsulation
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Topics: Cavities, Cross-flow, Flow (Dynamics), Molding, Epoxy adhesives, Epoxy resins, Semiconductors (Materials)
Journal Articles

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

S. Han, K. K. Wang, D. L. Crouthamel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 247–254.
https://doi.org/10.1115/1.2792245
Published Online: December 1, 1997
View Article titled, Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation
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Topics: Semiconductors (Materials), Wire, Cavities, Epoxy adhesives, Epoxy resins, Manufacturing, Materials properties, Molding, Shapes, Temperature
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Article titled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 178–184.
https://doi.org/10.1115/1.2792089
Published Online: September 1, 1995
View Article titled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding
Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

S. V. Garimella, D. J. Schlitz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 410–415.
https://doi.org/10.1115/1.2909350
Published Online: December 1, 1993
View Article titled, Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Article titled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
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Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design